DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박효훈 | ko |
dc.contributor.author | 유종범 | ko |
dc.contributor.author | 유동은 | ko |
dc.contributor.author | 이주범 | ko |
dc.contributor.author | 김인기 | ko |
dc.contributor.author | 석태준 | ko |
dc.contributor.author | 강금봉 | ko |
dc.contributor.author | 윤현호 | ko |
dc.contributor.author | 권남현 | ko |
dc.date.accessioned | 2023-05-12T02:05:11Z | - |
dc.date.available | 2023-05-12T02:05:11Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/306753 | - |
dc.description.abstract | Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer. | - |
dc.title | OPTICAL PHASED ARRAY CHIP USING MEMS SWITCH AND MANUFACTURING METHOD THEREOF | - |
dc.title.alternative | MEMS 광 스위치를 활용하는 광 위상 배열 칩 및 그 제조 방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 박효훈 | - |
dc.contributor.nonIdAuthor | 유종범 | - |
dc.contributor.nonIdAuthor | 유동은 | - |
dc.contributor.nonIdAuthor | 이주범 | - |
dc.contributor.nonIdAuthor | 김인기 | - |
dc.contributor.nonIdAuthor | 석태준 | - |
dc.contributor.assignee | KAIST, GIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 17576212 | - |
dc.identifier.patentRegistrationNumber | 11640030 | - |
dc.date.application | 2022-01-14 | - |
dc.date.registration | 2023-05-02 | - |
dc.publisher.country | US | - |
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