High-Bandwidth InGaAs Photodetectors Heterogeneously Integrated on Silicon Waveguides Using Optofluidic Assembly

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Light-induced manipulation techniques have been utilized to transport, trap, or levitate microscopic objects for a wide range of applications in biology, electronics, and photonics. Without making direct physical contact, they can provide simple yet powerful means for high-precision assembly of microscale functional blocks and components within the integrated circuit platforms, thereby offering a viable alternative to the conventional heterogeneous integration techniques, such as wafer/die bonding and transfer printing. Using a microbubble-based optofluidic pick-and-place assembly process, heterogeneous integration of compact III-V semiconductor photodetectors on a silicon-based photonic integrated circuit chip, enabling direct high-speed vertical electrical contacts for significantly improved photogenerated carrier transit distance/time, is experimentally demonstrated. The microdisk-shaped InGaAs p-i-n photodetector integrated on the silicon waveguide has a 3 dB bandwidth exceeding 50 GHz under the applied bias voltage of -1 V for near-infrared wavelengths around 1.55 mu m. The light-induced optofluidic assembly will provide a promising route for seamless heterogeneous integration of various optoelectronic components with high-speed and low-noise electrical interconnection on the fully processed silicon photonic/electronic integrated circuit platforms.
Publisher
WILEY-V C H VERLAG GMBH
Issue Date
2022-03
Language
English
Article Type
Article
Citation

LASER & PHOTONICS REVIEWS, v.16, no.3

ISSN
1863-8880
DOI
10.1002/lpor.202100306
URI
http://hdl.handle.net/10203/292799
Appears in Collection
EE-Journal Papers(저널논문)
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