High-Density Diffusion Barrier to Improve Thermal Stability of Temporary Bonding De-Bonding (TBDB) System
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김유손 | ko |
| dc.contributor.author | 전민규 | ko |
| dc.contributor.author | 임성갑 | ko |
| dc.date.accessioned | 2021-11-17T06:44:42Z | - |
| dc.date.available | 2021-11-17T06:44:42Z | - |
| dc.date.created | 2021-11-16 | - |
| dc.date.issued | 2021-11-05 | - |
| dc.identifier.citation | 2021 한국공업화학회 추계 총회 및 학술대회 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/289221 | - |
| dc.language | English | - |
| dc.publisher | 한국공업화학회 | - |
| dc.title | High-Density Diffusion Barrier to Improve Thermal Stability of Temporary Bonding De-Bonding (TBDB) System | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2021 한국공업화학회 추계 총회 및 학술대회 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 대구 EXCO | - |
| dc.contributor.localauthor | 임성갑 | - |
| dc.contributor.nonIdAuthor | 김유손 | - |
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