Mechanical Abrasion by Bi-layered Pad Micro-Asperity in Chemical Mechanical Polishing

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Pad asperities in chemical-mechanical polishing (CMP) provide necessary forces for mechanical abrasion. This article investigates the abrasive behaviour of polishing pads at the asperity contact scale. A contact mechanics model predicts that compliant and soft asperities or rigid and hard asperities may solely achieve either large contact area or high indentation depth respectively, whereas bi-layered asperities can enable both the enlarged contact and deep abrasion. Hemispherical pad micro-asperities with precise dimensions, including the new bi-layered design, were fabricated using thermal reflow and micro-replica molding techniques and their polishing behaviours were experimentally compared using a pin-on-disk polishing setup. (c) 2021 CIRP. Published by Elsevier Ltd. All rights reserved.
Publisher
Elsevier BV
Issue Date
2021-07
Language
English
Article Type
Article
Citation

CIRP ANNALS-MANUFACTURING TECHNOLOGY, v.70, no.1, pp.273 - 276

ISSN
0007-8506
DOI
10.1016/j.cirp.2021.04.012
URI
http://hdl.handle.net/10203/286948
Appears in Collection
ME-Journal Papers(저널논문)
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