Data Sanitization of SRAM by Thermal Distortion

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dc.contributor.authorHan, Joon-Kyuko
dc.contributor.authorHan, Seong-Jooko
dc.contributor.authorYu, Ji-Manko
dc.contributor.authorChoi, Yang-Kyuko
dc.date.accessioned2021-07-20T01:30:22Z-
dc.date.available2021-07-20T01:30:22Z-
dc.date.created2021-06-21-
dc.date.created2021-06-21-
dc.date.issued2021-07-
dc.identifier.citationIEEE TRANSACTIONS ON ELECTRON DEVICES, v.68, no.7, pp.3706 - 3710-
dc.identifier.issn0018-9383-
dc.identifier.urihttp://hdl.handle.net/10203/286773-
dc.description.abstractThermal distortion of a memory state is demonstrated for data sanitization of static random access memory (SRAM). Data stored in SRAM are believed to be deleted when power is turned off. However, it has been reported that the data can remain for a certain time even in powered-off SRAM, especially in a low-temperature environment. When a cold boot attack is attempted at low temperature, the stored data in SRAM are secured by thermal distortion at induced high temperature. For an experimental demonstration of data sanitization, heat is intentionally applied to a commercial SRAM chip, which is connected with a Raspberry pi board to write and read data. Supportive circuit and thermal simulations are performed to analyze electrical and thermal characteristics during heat treatment.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleData Sanitization of SRAM by Thermal Distortion-
dc.typeArticle-
dc.identifier.wosid000665041900084-
dc.identifier.scopusid2-s2.0-85106713081-
dc.type.rimsART-
dc.citation.volume68-
dc.citation.issue7-
dc.citation.beginningpage3706-
dc.citation.endingpage3710-
dc.citation.publicationnameIEEE TRANSACTIONS ON ELECTRON DEVICES-
dc.identifier.doi10.1109/TED.2021.3078667-
dc.contributor.localauthorChoi, Yang-Kyu-
dc.contributor.nonIdAuthorHan, Seong-Joo-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorRandom access memory-
dc.subject.keywordAuthorDistortion-
dc.subject.keywordAuthorSRAM chips-
dc.subject.keywordAuthorElectromagnetic compatibility-
dc.subject.keywordAuthorTemperature distribution-
dc.subject.keywordAuthorThermal analysis-
dc.subject.keywordAuthorTemperature measurement-
dc.subject.keywordAuthorData sanitization-
dc.subject.keywordAuthorsecurity-
dc.subject.keywordAuthorstatic random access memory (SRAM)-
dc.subject.keywordAuthorthermal distortion-
dc.subject.keywordPlusLEAKAGE-CURRENT-
dc.subject.keywordPlusIMPACT-
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EE-Journal Papers(저널논문)
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