Quinone curable compositions and adhesive compositions comprising same퀴논 경화형 조성물 및 이를 포함하는 접착제 조성물

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The present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.
Assignee
KAIST, KOLON INDUSTRIES INC
Country
US (United States)
Application Date
2017-09-27
Application Number
16337179
Registration Date
2021-05-11
Registration Number
11001683
URI
http://hdl.handle.net/10203/286504
Appears in Collection
CH-Patent(특허)
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