Cu-Cu joining using citrate coated ultra-small nano-silver pastes

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dc.contributor.authorZhang, Shuyeko
dc.contributor.authorWang, Qianko
dc.contributor.authorLin, Tiesongko
dc.contributor.authorZhang, Pengzheko
dc.contributor.authorHe, Pengko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2021-03-11T02:50:14Z-
dc.date.available2021-03-11T02:50:14Z-
dc.date.created2021-03-11-
dc.date.created2021-03-11-
dc.date.issued2021-02-
dc.identifier.citationJOURNAL OF MANUFACTURING PROCESSES, v.62, pp.546 - 554-
dc.identifier.issn1526-6125-
dc.identifier.urihttp://hdl.handle.net/10203/281466-
dc.description.abstractIn this study, ultra-small nano-Ag particles with an average diameter of 4.76 nm and excellent stability have been synthesized on a large scale to meet low-temperature, low-pressure, and lead-free packaging requirements for modern high-power electronic applications. Citrate coated nano-Ag particles' agglomerations have been used in the form of a nano-Ag paste to solder by a robust Cu to Cu direct bonding. The bonding strength of the formed Cu-Cu joint reaches 28.2 MPa when sintered at 260 degrees C for 30 min and 1 MPa. The bonding mechanism of such a direct Cu-Cu bonding by using nano-Ag paste has been facilitated by the assistance of an in-situ sintering of nanoAg particles. The analysis of the bonding has been performed using a transmission electron microscopy (TEM) and a focused ion beam (FIB). The results show that the bonding mechanism can be interpreted by two parts: (1) self-sintering process of nano-Ag paste, and (2) interfacial bonding between sintered nano-Ag paste and Cu substrate.-
dc.languageEnglish-
dc.publisherELSEVIER SCI LTD-
dc.titleCu-Cu joining using citrate coated ultra-small nano-silver pastes-
dc.typeArticle-
dc.identifier.wosid000616475400005-
dc.identifier.scopusid2-s2.0-85098801201-
dc.type.rimsART-
dc.citation.volume62-
dc.citation.beginningpage546-
dc.citation.endingpage554-
dc.citation.publicationnameJOURNAL OF MANUFACTURING PROCESSES-
dc.identifier.doi10.1016/j.jmapro.2020.11.043-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorZhang, Shuye-
dc.contributor.nonIdAuthorWang, Qian-
dc.contributor.nonIdAuthorLin, Tiesong-
dc.contributor.nonIdAuthorZhang, Pengzhe-
dc.contributor.nonIdAuthorHe, Peng-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorElectronic packaging-
dc.subject.keywordAuthorNano-Ag paste-
dc.subject.keywordAuthorCu-Cu joint-
dc.subject.keywordAuthorLow-temperature sintering-
dc.subject.keywordAuthorBonding mechanism-
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