DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zhang, Shuye | ko |
dc.contributor.author | Wang, Qian | ko |
dc.contributor.author | Lin, Tiesong | ko |
dc.contributor.author | Zhang, Pengzhe | ko |
dc.contributor.author | He, Peng | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2021-03-11T02:50:14Z | - |
dc.date.available | 2021-03-11T02:50:14Z | - |
dc.date.created | 2021-03-11 | - |
dc.date.created | 2021-03-11 | - |
dc.date.issued | 2021-02 | - |
dc.identifier.citation | JOURNAL OF MANUFACTURING PROCESSES, v.62, pp.546 - 554 | - |
dc.identifier.issn | 1526-6125 | - |
dc.identifier.uri | http://hdl.handle.net/10203/281466 | - |
dc.description.abstract | In this study, ultra-small nano-Ag particles with an average diameter of 4.76 nm and excellent stability have been synthesized on a large scale to meet low-temperature, low-pressure, and lead-free packaging requirements for modern high-power electronic applications. Citrate coated nano-Ag particles' agglomerations have been used in the form of a nano-Ag paste to solder by a robust Cu to Cu direct bonding. The bonding strength of the formed Cu-Cu joint reaches 28.2 MPa when sintered at 260 degrees C for 30 min and 1 MPa. The bonding mechanism of such a direct Cu-Cu bonding by using nano-Ag paste has been facilitated by the assistance of an in-situ sintering of nanoAg particles. The analysis of the bonding has been performed using a transmission electron microscopy (TEM) and a focused ion beam (FIB). The results show that the bonding mechanism can be interpreted by two parts: (1) self-sintering process of nano-Ag paste, and (2) interfacial bonding between sintered nano-Ag paste and Cu substrate. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCI LTD | - |
dc.title | Cu-Cu joining using citrate coated ultra-small nano-silver pastes | - |
dc.type | Article | - |
dc.identifier.wosid | 000616475400005 | - |
dc.identifier.scopusid | 2-s2.0-85098801201 | - |
dc.type.rims | ART | - |
dc.citation.volume | 62 | - |
dc.citation.beginningpage | 546 | - |
dc.citation.endingpage | 554 | - |
dc.citation.publicationname | JOURNAL OF MANUFACTURING PROCESSES | - |
dc.identifier.doi | 10.1016/j.jmapro.2020.11.043 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Zhang, Shuye | - |
dc.contributor.nonIdAuthor | Wang, Qian | - |
dc.contributor.nonIdAuthor | Lin, Tiesong | - |
dc.contributor.nonIdAuthor | Zhang, Pengzhe | - |
dc.contributor.nonIdAuthor | He, Peng | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Electronic packaging | - |
dc.subject.keywordAuthor | Nano-Ag paste | - |
dc.subject.keywordAuthor | Cu-Cu joint | - |
dc.subject.keywordAuthor | Low-temperature sintering | - |
dc.subject.keywordAuthor | Bonding mechanism | - |
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