Organic device having protective film and method of manufacturing the same

Abstract

The present invention provides a method of manufacturing an organic device having a protective film, the method including: providing bonding layers (adhesives) on one surface of a first substrate and one surface of a second substrate; providing an organic device on the other surface of the first substrate; and providing the second substrate on the organic device such that the bonding layer (adhesive) provided on the second substrate is in contact with the organic device. Since the organic device having the protective film according to the present invention may be attached to other materials through the bonding layer (adhesive), it is not necessary to apply heat in order to attach the organic device to other materials, and as a result, it is possible to attach the organic device to various materials having various shapes regardless of types and shapes of materials. Further, according to the organic device having the protective film according to the present invention, since the protective film is formed as the substrate having the bonding layer (adhesive) 220 is attached to the organic device 300, no heat is applied to the organic device 300 during the process of forming the protective film, and as a result, it is possible to minimize deformation of the organic device 300 by minimizing physical and chemical stress to be applied to the organic device 300. According to the organic device having the protective film according to the present invention, the two protective film layers for protecting the organic device are manufactured through the same process, and as a result, it is possible to innovatively reduce the process time required to manufacture the organic device having the protective film in comparison with the process in the related art.