Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide저전력, 고속 멀티-채널 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스

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An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
Assignee
KAIST
Country
IT (Italy)
Application Date
2013-09-12
Application Number
13867509.5
Registration Date
2018-10-03
Registration Number
2939307
URI
http://hdl.handle.net/10203/280912
Appears in Collection
EE-Patent(특허)
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