Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits

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Publisher
IEEE
Issue Date
2020-12-15
Language
English
Citation

66th IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)

DOI
10.1109/IEDM13553.2020.9372102
URI
http://hdl.handle.net/10203/277756
Appears in Collection
EE-Conference Papers(학술회의논문)
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