Crystalline Phase-Controlled High-Quality Hafnia Ferroelectric With RuO2 Electrode

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dc.contributor.authorGoh, Younginko
dc.contributor.authorCho, Sung Hyunko
dc.contributor.authorPark, Sang-Hee Koko
dc.contributor.authorJeon, Sanghunko
dc.date.accessioned2020-08-25T08:55:08Z-
dc.date.available2020-08-25T08:55:08Z-
dc.date.created2020-08-19-
dc.date.created2020-08-19-
dc.date.created2020-08-19-
dc.date.created2020-08-19-
dc.date.issued2020-08-
dc.identifier.citationIEEE TRANSACTIONS ON ELECTRON DEVICES, v.67, no.8, pp.3431 - 3434-
dc.identifier.issn0018-9383-
dc.identifier.urihttp://hdl.handle.net/10203/275977-
dc.description.abstractElectrical and reliability characteristics of hafnia ferroelectric capacitor are influenced by a capping electrode layer which controls the type of stress and the amount of oxygen vacancy inside hafnia. Here, we present the impact of metal nitride and metal oxide electrode on the ferroelectricity of a Hf0.5Zr0.5O2 (HZO) capacitor. For comparison, we employed two different top electrodes (RuO2 and TiN) with hafnia ferroelectric layer, forming RuO2/HZO/TiN and TiN/HZO/TiN capacitors. The RuO2 top electrode provides additional oxygen to the HZO film, lowering the amount of oxygen vacancies in the film. From material analysis, we found that the top RuO2/HZO interface exhibits less oxygen vacancy in comparison to the top TiN/HZO interface. In addition, for RuO2/HZO/TiN, due to different thermal expansion coefficient between top and bottom electrodes, the HZO film experiences significant tensile stress, resulting in the high o-phase formation and remnant polarization (similar to 20 mu C/cm(2)) as compared with that of TiN/HZO/TiN capacitor (similar to 13 mu C/cm(2)). This article suggests an efficient solution to reduce the interfacial defects and oxygen vacancies as well as to enhance o-phase formation and ferroelectricity.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleCrystalline Phase-Controlled High-Quality Hafnia Ferroelectric With RuO2 Electrode-
dc.typeArticle-
dc.identifier.wosid000552976100064-
dc.identifier.scopusid2-s2.0-85089343139-
dc.type.rimsART-
dc.citation.volume67-
dc.citation.issue8-
dc.citation.beginningpage3431-
dc.citation.endingpage3434-
dc.citation.publicationnameIEEE TRANSACTIONS ON ELECTRON DEVICES-
dc.identifier.doi10.1109/TED.2020.2998444-
dc.contributor.localauthorPark, Sang-Hee Ko-
dc.contributor.localauthorJeon, Sanghun-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorCapping layer-
dc.subject.keywordAuthorferroelectric-
dc.subject.keywordAuthorhafnia thin film-
dc.subject.keywordAuthorinterfacial dead layer-
dc.subject.keywordAuthoroxygen vacancy-
dc.subject.keywordAuthorRuO2 oxide metal-
dc.subject.keywordPlusTHIN-FILMS-
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