DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Jae-Hyeong | ko |
dc.contributor.author | Park, Jongcheol | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2020-06-26T02:20:55Z | - |
dc.date.available | 2020-06-26T02:20:55Z | - |
dc.date.created | 2020-06-17 | - |
dc.date.issued | 2019-05 | - |
dc.identifier.citation | 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2213 - 2218 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/274909 | - |
dc.description.abstract | A TLP (Transient Liquid Phase) bonding of Ultrasonic transducers using low temperature eutectic Sn-In solder ACFs and Au pads, where the final solder joint consists of Au-In-Sn intermetallics with higher melting point, has been investigated. Sn52In solder ACFs were fabricated and thermo-compression bonded at 130 degrees C for 30 seconds to bond ultrasonic transducer on Flex Printed Circuits (FPCs). Scanning electron microscopy (SEM) / energy dispersive x-ray spectroscopy (EDX) analysis of solder joint cross-sections show that the microstructure of intermetallic compounds (IMCs) were consisted of Au-In and Sn rich-In phases. Based upon EDX analysis, the Au-In-Sn intermetallic compounds are found. The aim of this study is to characterize eutectic Sn-In solder ACFs bonding method suitable for temperature limited bonding environment as well as for flexible ultrasonic transducer applications. Pressure Cooker Test (2 atm, 100% Relative Humidity at 121 degrees C) and Dynamic bending test (R: 7mm) were also carried out to examine the bonding reliability. And these results were compared with conventional metal coated polymer particles ACFs. After a pressure cooker test, the final intermetallic compound was Au-In-Sn ternary phase, which is thermally stable at higher temperatures as high as 380 degrees C. The TLP bonding with Sn-In solder ACFs offers very reliable metallurgical bonding and excellent compatibility for ferroelectric ultrasonic transducers with rough surfaces. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Low Temperature Transient Liquid Phase (TLP) bonding using eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer | - |
dc.type | Conference | - |
dc.identifier.wosid | 000503261500333 | - |
dc.identifier.scopusid | 2-s2.0-85072282201 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 2213 | - |
dc.citation.endingpage | 2218 | - |
dc.citation.publicationname | 69th IEEE Electronic Components and Technology Conference (ECTC) | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Las Vegas, NV | - |
dc.identifier.doi | 10.1109/ECTC.2019.00-15 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Park, Jae-Hyeong | - |
dc.contributor.nonIdAuthor | Park, Jongcheol | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.