DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, Seung-Yoon | ko |
dc.contributor.author | Lee, Tae-Ik | ko |
dc.contributor.author | Cho, Minsun | ko |
dc.contributor.author | Kim, Taek-Soo | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2020-04-13T06:20:24Z | - |
dc.date.available | 2020-04-13T06:20:24Z | - |
dc.date.created | 2020-04-08 | - |
dc.date.created | 2020-04-08 | - |
dc.date.created | 2020-04-08 | - |
dc.date.created | 2020-04-08 | - |
dc.date.issued | 2020-03 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/273877 | - |
dc.description.abstract | In this article, chip-on-fabric (COFa) assemblies using anisotropic conductive films (ACFs) and metal-laminated fabric substrates were investigated. To fabricate the metal-laminated fabric substrates, electroless nickel-immersion gold (ENIG) metal-finished Cu circuits were fabricated on the B-stage nonconductive films (NCFs), followed by laminating onto the fabrics. Then, the 50- $\mu \text{m}$ -thick Si chip was bonded onto the fabric substrates using ACFs with a thermocompression (T/C) bonding method. First, the ACFs' joint properties, such as electrical resistances and adhesion strengths, were evaluated and compared with conventional chip-on-flex (COF) assembly. To enhance static bending flexibility without chip fracture, chip-in-fabric (CIFa) assemblies were developed after optimizing the thickness of a cover layer on the Si chip. Finally, mechanical and moisture-related reliability of the CIFa packages was evaluated through dynamic bending, 85 degrees C/85% relative humidity (RH), and washing reliability. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates | - |
dc.type | Article | - |
dc.identifier.wosid | 000520493900002 | - |
dc.identifier.scopusid | 2-s2.0-85081995962 | - |
dc.type.rims | ART | - |
dc.citation.volume | 10 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 360 | - |
dc.citation.endingpage | 367 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2020.2968359 | - |
dc.contributor.localauthor | Kim, Taek-Soo | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Cho, Minsun | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Anisotropic conductive film (ACF) | - |
dc.subject.keywordAuthor | bending test | - |
dc.subject.keywordAuthor | chip on fabric (COFa) | - |
dc.subject.keywordAuthor | flexibility | - |
dc.subject.keywordAuthor | metal-laminated fabric substrate | - |
dc.subject.keywordAuthor | washability | - |
dc.subject.keywordPlus | BENDING RELIABILITY | - |
dc.subject.keywordPlus | ABSORPTION | - |
dc.subject.keywordPlus | SENSORS | - |
dc.subject.keywordPlus | FIBERS | - |
dc.subject.keywordPlus | GLASS | - |
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