Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain

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dc.contributor.authorCuddalorepatta, Gayatri K.ko
dc.contributor.authorSim, Gi-Dongko
dc.contributor.authorLi, Hanko
dc.contributor.authorPantuso, Danielko
dc.contributor.authorVlassak, Joost J.ko
dc.date.accessioned2019-12-20T06:22:46Z-
dc.date.available2019-12-20T06:22:46Z-
dc.date.created2019-11-07-
dc.date.created2019-11-07-
dc.date.issued2019-10-
dc.identifier.citationJOURNAL OF MATERIALS RESEARCH, v.34, no.20, pp.3474 - 3482-
dc.identifier.issn0884-2914-
dc.identifier.urihttp://hdl.handle.net/10203/270045-
dc.description.abstractElastic modulus and residual stress in freestanding ultrathin films (<100 nm) are characterized using bilayer cantilevers. The cantilevers comprise a test film and a well-characterized reference material (SU-8). When released from the substrate, residual stresses in the bilayer cantilever cause it to deflect with measurable curvatures, allowing the determination of both stiffness and residual stress of the test film. The technique does not require sophisticated mechanical test equipment and serves as a useful metrology tool for characterizing coatings immediately after fabrication in a clean room assembly line. The measured biaxial modulus and residual strain of 75 nm copper films are 211 ± 19 GPa and (7.05 ± 0.22) × 10-3, respectively. Additional experiments on the freestanding structures yield a mean Young's modulus of 115 GPa. These properties are in close agreement with those measured from additional residual stress-driven structures developed on the same coatings by the authors.-
dc.languageEnglish-
dc.publisherCAMBRIDGE UNIV PRESS-
dc.titleResidual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain-
dc.typeArticle-
dc.identifier.wosid000510321000009-
dc.identifier.scopusid2-s2.0-85073635074-
dc.type.rimsART-
dc.citation.volume34-
dc.citation.issue20-
dc.citation.beginningpage3474-
dc.citation.endingpage3482-
dc.citation.publicationnameJOURNAL OF MATERIALS RESEARCH-
dc.identifier.doi10.1557/jmr.2019.278-
dc.contributor.localauthorSim, Gi-Dong-
dc.contributor.nonIdAuthorCuddalorepatta, Gayatri K.-
dc.contributor.nonIdAuthorLi, Han-
dc.contributor.nonIdAuthorPantuso, Daniel-
dc.contributor.nonIdAuthorVlassak, Joost J.-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorultrathin film-
dc.subject.keywordAuthorbiaxial modulus-
dc.subject.keywordAuthorelastic behavior-
dc.subject.keywordAuthorresidual strain-
dc.subject.keywordAuthorresidual stress-
dc.subject.keywordAuthorcurvature-
dc.subject.keywordAuthorfreestanding-
dc.subject.keywordAuthorXeF2 etch-
dc.subject.keywordAuthorcopper-
dc.subject.keywordAuthorforce deflection-
dc.subject.keywordAuthorSU-8-
dc.subject.keywordPlusGRAIN-SIZE-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordPlusMECHANICAL-PROPERTIES-
dc.subject.keywordPlusSU-8-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusMODULI-
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ME-Journal Papers(저널논문)
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