Thermal issues in 3D IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 신인섭 | ko |
| dc.contributor.author | 김상민 | ko |
| dc.contributor.author | 백승훈 | ko |
| dc.contributor.author | 서문준 | ko |
| dc.contributor.author | 유리은 | ko |
| dc.contributor.author | 신영수 | ko |
| dc.date.accessioned | 2019-12-13T13:29:48Z | - |
| dc.date.available | 2019-12-13T13:29:48Z | - |
| dc.date.created | 2019-11-26 | - |
| dc.date.issued | 2009-09 | - |
| dc.identifier.citation | 3차원반도체집적기술 특집 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/269716 | - |
| dc.language | English | - |
| dc.publisher | 전자공학회지 | - |
| dc.title | Thermal issues in 3D IC | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 3차원반도체집적기술 특집 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.contributor.localauthor | 신영수 | - |
| dc.contributor.nonIdAuthor | 유리은 | - |
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