Makespan Analysis of Lot Switching Period in Cluster Tools

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Cluster tools each of which consists of processing modules, a transport robot, and loadlocks perform most wafer fabrication processes in semiconductor manufacturing. Recently, the lot size has been decreasing from 25 wafers to even 7-8 wafers due to the larger wafer size and circuit width reduction especially in large-scale integration manufacturing. Hence, the lot switching operation between two consecutive wafer lots occurs frequently. In this paper, we derive closed-form expressions of the makespan of the lot switching period in single-armed and dual-armed cluster tools with the given robot task sequences for the first time. With this research, the completion time of a wafer lot can be easily estimated even though its preceding or next lot is processed together during the lot switching period. Hence, the makespan can be used for integrating operation of overhead hoist transports and cluster tools and assigning wafer lots to cluster tools while minimizing the lot switching period.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2016-05
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.29, no.2, pp.127 - 136

ISSN
0894-6507
DOI
10.1109/TSM.2016.2530810
URI
http://hdl.handle.net/10203/266084
Appears in Collection
IE-Journal Papers(저널논문)
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