Monolithic integration of GaAs//InGaAs photodetectors for multicolor detection

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Multicolor photodetectors (PDs) by using bulk p-i-n based visible GaAs and near-infrared (IR) InGaAs PD have been successfully fabricated via monolithic integration by wafer bonding and epitaxial lift-off. It showed high-performance individual operation comparable to that of bulk PDs with tight vertical alignment on a single substrate for future high-resolution multicolor PDs. At the same time, it covered a broad wavelength range from visible to IR.
Publisher
The IEEE Electron Devices Society,The Japan Society of Applied Physics
Issue Date
2019-06
Language
English
Citation

39th Symposium on VLSI Technology, VLSI Technology 2019

ISSN
0743-1562
DOI
10.23919/VLSIT.2019.8776526
URI
http://hdl.handle.net/10203/262651
Appears in Collection
EE-Conference Papers(학술회의논문)
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