A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

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Electrically conductive adhesives (ECAs) are mainly used in IC packaging, LED packaging and other electronic industry to replace the traditional soldering and lead-free solders, therefore, there is a constant need to improve the electrical conductive and mechanical property of ECAs. In this study, the electrical resistivity and shear strength of the modified nano-Ag coated Cu particles in ECA was investigated and compromised, in terms of filler contents, curing temperature and curing time. The conductive mechanism of the modified nano-Ag coated Cu particles in ECA was discussed as the filler content increased. Finally, the filler content was optimized by 23.5 vol% and 170 degrees C 100min curing condition was selected to obtain the compromised property (5.159x10(-6) cm 6.121MPa), which is better than the previous one (4.99x10(-6) cm, 4.406MPa) at 200 degrees C. The tested data, as well as the failure mode and fracture interfaces, were carried out in this study.
Publisher
SPRINGER
Issue Date
2019-05
Language
English
Article Type
Article
Citation

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183

ISSN
0957-4522
DOI
10.1007/s10854-019-01246-8
URI
http://hdl.handle.net/10203/262574
Appears in Collection
MS-Journal Papers(저널논문)
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