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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

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dc.contributor.authorLee, Soon-Bokko
dc.date.accessioned2019-04-16T00:50:20Z-
dc.date.available2019-04-16T00:50:20Z-
dc.date.created2014-01-14-
dc.date.issued2012-10-10-
dc.identifier.citationJSME-CMD ICMS2012-
dc.identifier.urihttp://hdl.handle.net/10203/259428-
dc.languageEnglish-
dc.publisherJapan Society of Mechanical Engineers-Computational Mechanics Division-
dc.titleExperimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameJSME-CMD ICMS2012-
dc.identifier.conferencecountryJA-
dc.identifier.conferencelocation고베-
dc.contributor.localauthorLee, Soon-Bok-
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ME-Conference Papers(학술회의논문)
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