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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek; Song, Jinwook; Park, Gyeyoung; Hong, Seokwoo; Park, Junyong; Cho, Kyungjun; Lee, Hyunsuk; Seo, Chulhun; Ahn, Seungyoung; Kim, Joungho, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06 | |
| Effect of Air-Gap Between a Ferrite Plate and Metal Strips on Magnetic Shielding Park, Hyun Ho; Kwon, Jong Hwa; Kwak, Sang Il; Ahn, Seungyoung, IEEE TRANSACTIONS ON MAGNETICS, v.51, no.11, 2015-11 | |
| Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Kim, Hyoungjun; Seo, Chulhun; Ahn, Seungyoung; Kim, Joungho, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02 | |
| High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
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