Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications

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Recently, heterogeneous integration has become more important in enhancing device performance and creating new functions. For this purpose, wafer bonding can provide a straightforward method to integrate different materials, regardless of lattice mismatch. Here, we review recent application spaces using low-temperature wafer bonding by classifying wafer bonding into direct bonding, oxide bonding, and metal bonding. We show that bonding materials and interfaces have an important role in achieving high-performance semiconductor devices.
Publisher
KOREAN PHYSICAL SOC
Issue Date
2019-01
Language
English
Article Type
Article; Proceedings Paper
Citation

JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.74, no.2, pp.82 - 87

ISSN
0374-4884
DOI
10.3938/jkps.74.82
URI
http://hdl.handle.net/10203/250374
Appears in Collection
EE-Journal Papers(저널논문)
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