Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum

Cited 1 time in webofscience Cited 0 time in scopus
  • Hit : 278
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorLee, Eung Changko
dc.contributor.authorRho, Jinsungko
dc.contributor.authorKang, Heeyoubko
dc.contributor.authorLee, Bong Jaeko
dc.date.accessioned2018-12-20T08:01:22Z-
dc.date.available2018-12-20T08:01:22Z-
dc.date.created2018-12-14-
dc.date.created2018-12-14-
dc.date.created2018-12-14-
dc.date.issued2018-12-
dc.identifier.citationIEEE ELECTRON DEVICE LETTERS, v.39, no.12, pp.1908 - 1911-
dc.identifier.issn0741-3106-
dc.identifier.urihttp://hdl.handle.net/10203/248676-
dc.description.abstractSolid-state drives (SSDs) have been widely used in data storage for micro satellites, data centers, and mobile products due to their high performance and high reliability. Recently, Samsung Electronics starts to introduce a ball grid array (BGA) non-volatile memory express (NVMe) SSD, which is a combined package of controller and memory units (i.e., DRAM and NAND) into one package. Due to the smaller form factor with high storage densities and multi-functional devices of BGA NVMe SSDs, a thermal issue becomes more important, requiring fundamental understanding of heat dissipation mechanism. Moreover, for applications in micro satellites, thermal analysis of SSDs should be conducted in vacuum environment. Here, we investigate the heat dissipation mechanism in the newly developed BGA NVMe SSD in both the atmosphere and high-vacuum conditions. A finite-element-method-based numerical model is developed for the heat transfer analysis and is verified by experiments at various workload conditions. © 2018 IEEE.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleThermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum-
dc.typeArticle-
dc.identifier.wosid000451587200021-
dc.identifier.scopusid2-s2.0-85055702512-
dc.type.rimsART-
dc.citation.volume39-
dc.citation.issue12-
dc.citation.beginningpage1908-
dc.citation.endingpage1911-
dc.citation.publicationnameIEEE ELECTRON DEVICE LETTERS-
dc.identifier.doi10.1109/LED.2018.2877613-
dc.contributor.localauthorLee, Bong Jae-
dc.contributor.nonIdAuthorKang, Heeyoub-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorBall grid array (BGA)-
dc.subject.keywordAuthorsolid state drive (SSD)-
dc.subject.keywordAuthornon-volatile memory express (NVMe)-
dc.subject.keywordAuthorthermal analysis-
dc.subject.keywordAuthorvacuum-
dc.subject.keywordPlusNAND FLASH MEMORY-
dc.subject.keywordPlusCO-DESIGN-
Appears in Collection
ME-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 1 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0