On-Chip Curing by Microwave for Long Term Usage of Electronic Devices in Harsh Environments

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Microwave-induced thermal curing is demonstrated to improve the reliability and to prolong the lifetime of chips containing nanoscale electron devices. A film containing graphite powder with high microwave absorbing efficiency was fabricated at low cost. The film is flexible, bendable, foldable, and attachable to a chip. A commercial off-the-shelf chip and a representative 3-dimensional (3D) metaloxide-semiconductor field-effect transistor (MOSFET), known as FinFET, were utilized to verify the curing behaviors of the microwave-induced heat treatment. The heat effectively cured not only total ionizing dose (TID) damage from the external environment, but also internal electrical stress such as hot-carrier injection (HCI), which are representative sources of damages in MOSFET insulators. Then, the characteristics of the pre- and post-curing electron devices are investigated using electrical measurements and numerical simulations.
Publisher
NATURE PUBLISHING GROUP
Issue Date
2018-10
Language
English
Article Type
Article
Citation

SCIENTIFIC REPORTS, v.8

ISSN
2045-2322
DOI
10.1038/s41598-018-33309-x
URI
http://hdl.handle.net/10203/246320
Appears in Collection
EE-Journal Papers(저널논문)
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