Electrothermal Analysis With Nonconvective Boundary Conditions

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dc.contributor.authorChoi, Suhyeongko
dc.contributor.authorShim, Seongboko
dc.contributor.authorShin, Youngsooko
dc.date.accessioned2018-08-21T04:40:12Z-
dc.date.available2018-08-21T04:40:12Z-
dc.date.created2018-08-20-
dc.date.created2018-08-20-
dc.date.issued2018-08-
dc.identifier.citationIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.65, no.8, pp.1044 - 1048-
dc.identifier.issn1549-7747-
dc.identifier.urihttp://hdl.handle.net/10203/245185-
dc.description.abstractElectrothermal analogy allows heat conduction and heat convection to be modeled as a simple resistive or RC network. A practical environment in which a chip is located is often not purely convective. Nonetheless, the environment is typically approximated as convective for simplicity of analysis. This yields inaccuracy of temperature estimation; ad hoc calibration process is necessary to match estimation and measurement by empirically adjusting thermal parameters. In this brief: 1) we extract electrothermal analogy through mathematical derivation and 2) this allows us to understand how the basic resistive network can be modified to handle non-convective environment accurately. The new network is applied in the estimation of steady-state and transient temperature as well as in thermal design power. A smartphone under the sunlight is assumed as an example of non-convective environment. Estimation of steady-state temperature using our network is compared to actual measurement, which demonstrates its accuracy.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectSIMULATION-
dc.subjectDESIGN-
dc.titleElectrothermal Analysis With Nonconvective Boundary Conditions-
dc.typeArticle-
dc.identifier.wosid000440693200016-
dc.identifier.scopusid2-s2.0-85041799979-
dc.type.rimsART-
dc.citation.volume65-
dc.citation.issue8-
dc.citation.beginningpage1044-
dc.citation.endingpage1048-
dc.citation.publicationnameIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS-
dc.identifier.doi10.1109/TCSII.2018.2805186-
dc.contributor.localauthorShin, Youngsoo-
dc.contributor.nonIdAuthorChoi, Suhyeong-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorElectrothermal analogy-
dc.subject.keywordAuthorthermal analysis-
dc.subject.keywordPlusSIMULATION-
dc.subject.keywordPlusDESIGN-
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