High-temperature tensile behavior of freestanding Au thin films

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The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340 degrees C, using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore, the flow stress decreases with decreasing film thickness, contravening the usual notion that "smaller is stronger". This behavior is attributed mainly to diffusion-facilitated grain boundary sliding. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
2014-03
Language
English
Article Type
Article
Keywords

STRAIN-RATE SENSITIVITY; MECHANICAL-PROPERTIES; DIFFUSIONAL CREEP; FATIGUE BEHAVIOR; GRAINED FILMS; LENGTH-SCALE; COPPER-FILMS; GOLD-FILMS; AG; CU

Citation

SCRIPTA MATERIALIA, v.75, pp.34 - 37

ISSN
1359-6462
DOI
10.1016/j.scriptamat.2013.11.011
URI
http://hdl.handle.net/10203/240180
Appears in Collection
ME-Journal Papers(저널논문)
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