High adhesion triple layered anisotropic conductive adhesive film
Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.
- Assignee
- KAIST
- Country
- US (United States)
- Issue Date
- 2005-04-12
- Application Date
- 2002-07-12
- Application Number
- 10193264
- Registration Date
- 2005-04-12
- Registration Number
- 6878435
- Appears in Collection
- MS-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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