High adhesion triple layered anisotropic conductive adhesive film

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Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.
Assignee
KAIST
Country
US (United States)
Issue Date
2005-04-12
Application Date
2002-07-12
Application Number
10193264
Registration Date
2005-04-12
Registration Number
6878435
URI
http://hdl.handle.net/10203/233770
Appears in Collection
MS-Patent(특허)
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