Photoresist composition, method of forming pattern using the photoresist composition and inkjet print head
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김진백 | ko |
| dc.date.accessioned | 2017-12-20T10:27:52Z | - |
| dc.date.available | 2017-12-20T10:27:52Z | - |
| dc.date.issued | 2012-04-24 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/232507 | - |
| dc.description.abstract | A photoresist composition including an oxetane-containing compound represented by Formula 1 or 2, an oxirane-containing compound represented by Formula 3 or 4, a photoinitiator, and a solvent, a method of forming a pattern using the photoresist composition, and an inkjet print head including a polymerization product of the photoresist composition.The photoresist composition provides a polymerization product which resists formation of cracks due to an inner stress, and has excellent heat tolerance, excellent chemical resistance, excellent adhesiveness, and excellent durability. | - |
| dc.title | Photoresist composition, method of forming pattern using the photoresist composition and inkjet print head | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | 김진백 | - |
| dc.contributor.assignee | Samsung Electronics Co., Ltd. | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 12040009 | - |
| dc.identifier.patentRegistrationNumber | 8163463 | - |
| dc.date.application | 2008-02-29 | - |
| dc.date.registration | 2012-04-24 | - |
| dc.publisher.country | US | - |
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