DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Bong Jun | ko |
dc.contributor.author | Seong, Hyejeong | ko |
dc.contributor.author | Shim, Hyunjeong | ko |
dc.contributor.author | Lee, Young Il | ko |
dc.contributor.author | Im, Sung Gap | ko |
dc.date.accessioned | 2017-08-08T06:47:46Z | - |
dc.date.available | 2017-08-08T06:47:46Z | - |
dc.date.created | 2017-08-07 | - |
dc.date.created | 2017-08-07 | - |
dc.date.issued | 2017-07 | - |
dc.identifier.citation | ADVANCED ENGINEERING MATERIALS, v.19, no.7 | - |
dc.identifier.issn | 1438-1656 | - |
dc.identifier.uri | http://hdl.handle.net/10203/225227 | - |
dc.description.abstract | For the fabrication of thin film encapsulation (TFE), sequential deposition of organic and inorganic layers is inevitable. A single-chamber system of initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is reported previously. Here, the substrate temperature (T-s) of the iCVD is aligned with that of ALD to facilitate the transition of the deposition mode by removing delays caused by repeated heating/cooling of the substrate. While increasing the T-s of iCVD from 40 to 90 degrees C, the process pressure is optimized so that the properties of the organic film are unchanged from that deposited with 40 degrees C. The T-s alignment significantly reduced the time delay during transition of the deposition mode, and the fabrication of the TFE is expedited. | - |
dc.language | English | - |
dc.publisher | WILEY-V C H VERLAG GMBH | - |
dc.subject | ATOMIC LAYER DEPOSITION | - |
dc.subject | MOISTURE BARRIER | - |
dc.subject | HOT-WIRE | - |
dc.subject | ICVD | - |
dc.subject | ACRYLATES) | - |
dc.subject | CVD | - |
dc.title | Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation | - |
dc.type | Article | - |
dc.identifier.wosid | 000405933900009 | - |
dc.identifier.scopusid | 2-s2.0-85017399023 | - |
dc.type.rims | ART | - |
dc.citation.volume | 19 | - |
dc.citation.issue | 7 | - |
dc.citation.publicationname | ADVANCED ENGINEERING MATERIALS | - |
dc.identifier.doi | 10.1002/adem.201600870 | - |
dc.contributor.localauthor | Im, Sung Gap | - |
dc.contributor.nonIdAuthor | Shim, Hyunjeong | - |
dc.contributor.nonIdAuthor | Lee, Young Il | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | ATOMIC LAYER DEPOSITION | - |
dc.subject.keywordPlus | MOISTURE BARRIER | - |
dc.subject.keywordPlus | HOT-WIRE | - |
dc.subject.keywordPlus | ICVD | - |
dc.subject.keywordPlus | ACRYLATES) | - |
dc.subject.keywordPlus | CVD | - |
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