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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

haracterization of Interface Bond Strength and Microstructure of Cu Composite

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정용진 / 남동훈 / 김경훈 / 이효수 / 권혁천 / 홍순형researcher
Publisher
대한금속재료학회
Issue Date
2010-04-22
Language
Korean
Citation

Spring Meeting of the Korean Institute of Metals and Materials, pp.245 - 245

URI
http://hdl.handle.net/10203/213344
Appears in Collection
MS-Conference Papers(학술회의논문)
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