An envelope modulator (EM) is presented to increase the efficiency of an RF power amplifier. In order to supply an output voltage higher than the input voltage while providing low-frequency power in the EM, a single-inductor dual-output (SIDO) converter is introduced. By employing the SIDO converter, the EM does not require an additional boost converter. In addition, a high-frequency converter (HFC) with a wide-bandwidth capability is also proposed. These two converters, the SIDO converter and the HFC, are combined in parallel without an ac coupling capacitor by employing a low-frequency current-balancing technique. The chip is implemented in a 0.18-mu m CMOS process and achieves 86.5% peak efficiency while tracking a 10-MHz long-term evolution envelope signal