Carbon Dioxide Sensor Substrate for Surface-mounted Packaging

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dc.contributor.author한혁진ko
dc.contributor.author김태완ko
dc.contributor.author박광민ko
dc.contributor.author박종욱ko
dc.date.accessioned2016-07-04T02:05:21Z-
dc.date.available2016-07-04T02:05:21Z-
dc.date.created2016-04-27-
dc.date.created2016-04-27-
dc.date.issued2015-05-
dc.identifier.citation센서학회지, v.24, no.3, pp.159 - 164-
dc.identifier.issn1225-5475-
dc.identifier.urihttp://hdl.handle.net/10203/208895-
dc.description.abstractSolid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.-
dc.languageKorean-
dc.publisher한국센서학회-
dc.titleCarbon Dioxide Sensor Substrate for Surface-mounted Packaging-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume24-
dc.citation.issue3-
dc.citation.beginningpage159-
dc.citation.endingpage164-
dc.citation.publicationname센서학회지-
dc.identifier.kciidART001995805-
dc.contributor.localauthor박종욱-
dc.contributor.nonIdAuthor김태완-
dc.subject.keywordAuthorSimulation-
dc.subject.keywordAuthorSensor substrate-
dc.subject.keywordAuthorHeat transfer effect-
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