Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

Cited 2 time in webofscience Cited 0 time in scopus
  • Hit : 93
  • Download : 0
This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2014-07
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON ELECTRON DEVICES, v.61, no.7, pp.2584 - 2587

ISSN
0018-9383
DOI
10.1109/TED.2014.2321453
URI
http://hdl.handle.net/10203/208365
Appears in Collection
EE-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 2 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0