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5
Novel and High-Yield Fabrication of Electroplated 3D Micro-Coils for MEMS and Microelectronics

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Micromachining and Microfabrication Process Technology IV, pp.233 - 240, Micromachining and Microfabrication Process Technology IV, 1998-09-21

6
Novel Fabrication of Electroplated 3D Micro-Coils Using 3D Photolithography of Thick Photoresist

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, International Microprocesses and Nanotechnology Conference, pp.85 - 86, The Korean Institute of Telematics and Electronics, 1998-07

7
Novel monolithic and multilevel integration of high-precision 3-D microfluidic components

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.183 - 191, SPIE, 1998-09-21

8
Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.316 - 325, SPIE, 1998-09-21

9
Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Yoon, Jun-Bo; Oh, G.Y.; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.297 - 306, SPIE, 1998-09-21

10
Uniform and Simultaneous Fabrication of High-Precision and High-Density Nozzles, Channels, and Cavities for Inkjet Printheads

Yoon, Jun-Bo; Kim, Choong Ki; Yoon, Euisik; Han, Chul-Hi, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3511, pp.214 - 224, 1998-09

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