Browse "RIMS Conference Papers" by Author Goldsmith C.
Showing results 2 to 3 of 3
| Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents Kang S.K.; Lauro P.; Shih D.-Y.; Henderson D.W.; Gosselin T.; Bartelo J.; Cain S.R.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667, 2004-06-01 |
| The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders Lu M.; Shih D.-Y.; Lauro P.; Kang S.; Goldsmith C.; Seo S.-K., 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.922 - 929, 2009-05-26 |
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