Browse "RIMS Conference Papers" by Author Henderson D.W.
Showing results 1 to 2 of 2
| Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM Lu M.; Lauro P.; Shih D.-Y.; Polastre R.; Goldsmith C.; Henderson D.W.; Zhang H.; et al, 2008 58th Electronic Components and Technology Conference, ECTC, pp.360 - 365, 2008-05-27 |
| Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents Kang S.K.; Lauro P.; Shih D.-Y.; Henderson D.W.; Gosselin T.; Bartelo J.; Cain S.R.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667, 2004-06-01 |
Discover
Type
- 3,515 Conference
Date issued
- 324 2020 - 2023
- 961 2010 - 2019
- 1,104 2000 - 2009
- 918 1990 - 1999
- 155 1980 - 1989