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1
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM

Lu M.; Lauro P.; Shih D.-Y.; Polastre R.; Goldsmith C.; Henderson D.W.; Zhang H.; et al, 2008 58th Electronic Components and Technology Conference, ECTC, pp.360 - 365, 2008-05-27

2
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents

Kang S.K.; Lauro P.; Shih D.-Y.; Henderson D.W.; Gosselin T.; Bartelo J.; Cain S.R.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667, 2004-06-01

3
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders

Lu M.; Shih D.-Y.; Lauro P.; Kang S.; Goldsmith C.; Seo S.-K., 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.922 - 929, 2009-05-26

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