Browse "RIMS Conference Papers" by Author Kim K.H.
Showing results 1 to 3 of 3
| Atomic layer deposited IrO-TiO thin film resistor for the thermal inkjet printheads Kwon S.H.; Kirn S.W.; Jeong S.J.; Kim K.H.; Kang S.W., Atomic Layer Deposition Applications 4 - 214th ECS Meeting, pp.315 - 319, 123, 2008-10-13 |
| Plasma-enhanced atomic layer deposition of Ta(C)N thin films for copper diffusion barrier Kim K.H.; Seong-Jun Jeong; Yoon J.S.; Kim Y.M.; Kwon S.H., 5th Symposium on Atomic Layer Deposition - 216th Meeting of the Electrochemical Society, v.25, pp.301 - 308, 2009-10-05 |
| The effects of heat treatment on the bonding strength of surface-activated bonding (SAB)-treated copper-nickel fine clad metals Kim K.H.; Lim S.C.; Kwon H.C., 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, pp.1932 - 1935, 2010-08-02 |
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