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Improving reliability of lateral thermosonic flip-chip bonding with ACF Ha C.-W.; Kim, Kyung-Soo, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.36 - 39, 123, 2009-12-09 |
Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF) Jang T.-Y.; Ha C.-W.; Kim, Kyung-Soo, 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.113 - 117, 2009-11-17 |
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