Browse "School of Electrical Engineering(전기및전자공학부)" by Type Article
Showing results 8141 to 8160 of 14244
| Microcomputer를 이용한 엘리베이터 모델의 제어 송형빈; 변증남, 전기학회지, v.16, no.2, pp.35 - 42, 1979-06 |
| Microcrystalline silicon solar cell using p-a-Si : H window layer deposited by photo-CVD method Kwak, Joong-Hwan; Kwon, Seong-Won; Park, Sang-Il; Yang, Ji-Hwan; Lim, Koeng-Su, SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.92, pp.1081 - 1085, 2008-09 |
| Microdischarge in microbridge plasma display with holes in the cathode Choi, Kyung Cheol, IEEE ELECTRON DEVICE LETTERS, v.19, no.6, pp.186 - 188, 1998-06 |
Microelectromechanical Systems-Based Neurotools for Non-Invasive Ultrasound Brain Stimulation Jo, Yehhyun; Oh, Chaerin; Lee, Hyunjoo Jenny, Chronobiology in Medicine, v.1, no.2, pp.55 - 59, 2019-06 |
| Microenvironmental Geometry Guides Platelet Adhesion and Spreading: A Quantitative Analysis at the Single Cell Level Kita, Ashley; Sakurai, Yumiko; Myers, David R.; Rounsevell, Ross; Huang, James N.; Seok, Tae Joon; Yu, Kyoungsik; et al, PLOS ONE, v.6, no.10, 2011-10 |
| Microfluidic neural probes: in vivo tools for advancing neuroscience Sim, Joo Yong; Haney, Matthew P.; Il Park, Sung; McCall, Jordan G.; Jeong, Jae-Woong, LAB ON A CHIP, v.17, no.8, pp.1406 - 1435, 2017-04 |
| Microlens array diffuser for a light-emitting diode backlight system Chang, Sung-Il; Yoon, Jun-Bo; Kim, Hongki; Kim, Jin-Jong; Lee, Baik-Kyu; Shin, Dong Ho, OPTICS LETTERS, v.31, no.20, pp.3016 - 3018, 2006-10 |
| Microlens for efficient coupling between LED and optical fiber eun-hyun park; m.-j. kim; Kwon, Young Se, IEEE PHOTONICS TECHNOLOGY LETTERS, v.11, no.4, pp.439 - 441, 1999-04 |
| Micromachined bridge-shaped spiral inductor on anodised aluminium substrate Kim, K-M.; Kim, J-H.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.6, pp.311 - 313, 2009-03 |
| Micromachined Fourier transform spectrometer on silicon optical bench platform Yu, Kyoungsik; Lee, D; Krishnamoorthy, U; Park, N; Solgaard, A, SENSORS AND ACTUATORS A-PHYSICAL, v.130, pp.523 - 530, 2006-08 |
| Micromolding fabrication of biocompatible dry micro-pyramid array electrodes for wearable biopotential monitoring Alban, Marco Vinicio; Lee, Haechang; Moon, Hanul; Yoo, Seunghyup, FLEXIBLE AND PRINTED ELECTRONICS, v.6, no.4, 2021-12 |
| Micropatterning Polydiacetylene Supramolecular Vesicles on Glass Substrates using a Pre-Patterned Hydrophobic Thin Film Choi, Ji-Min; Yoon, Bora; Choi, Kyungyong; Seol, Myeong-Lok; Kim, Jong-Man; Choi, Yang-Kyu, MACROMOLECULAR CHEMISTRY AND PHYSICS, v.213, no.6, pp.610 - 616, 2012-03 |
| Microscale Inorganic LED Based Wireless Neural Systems for Chronic in vivo Optogenetics Qazi, Raza; Kim, Choong Yeon; Byun, Sang-Hyuk; Jeong, Jae-Woong, FRONTIERS IN NEUROSCIENCE, v.12, 2018-10 |
| Microscopic origin of bipolar resistive switching of nanoscale titanium oxide thin films Jeong, Hu Young; Lee, JeongYong; Choi, Sung-Yool; Kim, Jeong Won, APPLIED PHYSICS LETTERS, v.95, no.16, 2009-10 |
| Microsecond Pulse I-V Approach to Understanding Defects in High Mobility Bi-layer Oxide Semiconductor Transistor Woo, Hyunsuk; Jeon, Sanghun, SCIENTIFIC REPORTS, v.7, 2017-08 |
| Microstrip patch array antenna with high isolation characteristic Jang, Hyeong-Seok; Lim, Won-Gyu; Son, Wang-Ik; Cha, Sung-Yong; Yu, Jong-Won, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.54, no.4, pp.973 - 976, 2012-04 |
| MICROSTRUCTURAL DEGRADATION DURING ZN DIFFUSION IN A GAINASP/INP HETEROSTRUCTURE - LAYER MIXING, MISFIT DISLOCATION GENERATION, AND ZN3P2 PRECIPITATION Park, HyoHoon; LEE, KH; Lee, JeongYong; LEE, YT; LEE, EH; LEE, JY; HONG, SK; et al, JOURNAL OF APPLIED PHYSICS, v.72, no.9, pp.4063 - 4072, 1992-11 |
| Microstructural Effects on Nickel Oxide Film Properties in an Infrared Electrochromic Window for Shutter-Less Infrared Sensor Application Shim, Hyun Bin; Kim, Woo Young; Kang, In-Ku; Lee, Hee Chul, IEEE SENSORS JOURNAL, v.17, no.20, pp.6522 - 6528, 2017-10 |
| MICROWAVE EMISSION FROM AN IRREGULAR SNOW LAYER Eom, Hyo Joon; LEE, KK; FUNG, AK, REMOTE SENSING OF ENVIRONMENT, v.13, no.5, pp.423 - 437, 1983 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
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