Browse "School of Electrical Engineering(전기및전자공학부)" by Subject 3D integrated circuits
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| Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) Kim, Dae Hyun; Athikulwongse, Krit; Healy, Michael B.; Hossain, Mohammad M.; Jung, Moongon; Khorosh, Ilya; Kumar, Gokul; et al, IEEE TRANSACTIONS ON COMPUTERS, v.64, no.1, pp.112 - 125, 2015-01 |
| Maximizing throughput in 3D multicore architectures = 3차원 다중프로세서 아키텍처에서의 처리효율 극대화link Khan, Asim; Kyung, Chong-Min; et al, 한국과학기술원, 2011 |
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