Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 36101 to 36120 of 50972
| Temperature measurement of Joule heated silicon micro/nanowires using selectively decorated quantum dots Yun, Jeonghoon; Ahn, Jae-Hyuk; Lee, Bong Jae; Moon, Dong-Il; Choi, Yang-Kyu; Park, Inkyu, NANOTECHNOLOGY, v.27, no.50, 2016-12 |
| TEMPERATURE PROFILE OF A SILICON-ON-INSULATOR MULTILAYER STRUCTURE IN SILICON RECRYSTALLIZATION WITH INCOHERENT-LIGHT SOURCE Kyung, Chong-Min, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.31, no.12, pp.1845 - 1851, 1984-12 |
| Temperature Sensor Using the Spontaneous Cut-Off in a Polymer-Silica Hybrid Optical Waveguide Yeo, DM; Shin, Sang Yung, Optoelectronics and Communications Conference, 2006 |
| Temperature- and bus traffic- aware data placement in 3D-stacked cache Lee, S.; Kang, K.; Kyung, Chong-Min, 2010 18th IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC 2010, pp.352 - 357, IEEE/IFIP, 2010-09-27 |
| Temperature-adaptive capacitor block and temperature-compensated crystal oscillator using it Yoo, Hoi-Jun; Shin, Hyung-Cheol; Je, Min-Kyu; Han, Seung-Ho, 2001-08-28 |
| Temperature-Aware Energy Minimization of 3D-Stacked L2 DRAM Cache through DVFS Kyung, Chong-Min; Kang, Kyungsu; Jung, Jongpil; Yun, Woojin, International SoC Design Conference (ISOCC), IEEE, 2012-11-06 |
| Temperature-Aware Integrated DVFS and Power Gating for Executing Tasks With Runtime Distribution Kang, Kyungsu; Kim, Jungsoo; Yoo, Sungjoo; Kyung, Chong-Min, IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, v.29, pp.1381 - 1394, 2010-09 |
| Temperature-aware Power Estimation for Dynamic Scaling of Supply and Body Bias Voltage in High-k/Metal Gate Technology Node 경종민, IEEK Summer Conference, IEEK, 2010 |
| Temperature-compensated wideband VCO integrated in dielectric spectroscopy = 온도 보상 광대역 전압 제어 발진기가 집적된 유전율 분광계link Lee, Kiho; Hong, Songcheol; et al, 한국과학기술원, 2022 |
Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability Oh, Yong Suk; Choi, Hyesun; Lee, Jaeho; Lee, Hyunwoo; Choi, Dong Yun; Lee, Sung Uk; Yun, Kyeong-Soo; et al, SCIENTIFIC REPORTS, v.7, 2017-09 |
| TEMPERATURE-DEPENDENCE OF MINORITY-CARRIER MOBILITY AND RECOMBINATION TIME IN P-TYPE GAAS BEYZAVI, K; Lee, Kwyro; KIM, DM; NATHAN, MI; WRENNER, K; WRIGHT, SL, APPLIED PHYSICS LETTERS, v.58, no.12, pp.1268 - 1270, 1991-03 |
| Temperature-dependent characteristics of InP-RTD-based microwave amplifier IC Lee, Jongwon; Yang, Kyoung-Hoon, ELECTRONICS LETTERS, v.53, no.15, pp.1058 - 1059, 2017-07 |
| TEMPERATURE-DEPENDENT HOLE AND ELECTRON-MOBILITY MODELS FOR CMOS CIRCUIT SIMULATION MIN, KS; Lee, Kwyro, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.42, no.11, pp.1956 - 1961, 1995-11 |
| Temperature-dependent phonon vibration and excitonic transition in a van der Waals heterostructure Park, Hamin; Choi, Sung-Yool, 2nd International Workshop on 2D Materials, 2nd International Workshop on 2D Materials, 2019-02-21 |
| Temperature-Dependent Plasmonic Response of Graphene Nanoresonators Kim, Junhyung; Lee, Geonwoo; Menabde, Sergey G.; Cho, Yong Jai; Rockstuhl, Carsten; Jang, Min Seok, ACS PHOTONICS, v.9, no.7, pp.2256 - 2262, 2022-06 |
| Temperature-Dependent Plasmonic Response of Graphene Nanoresonators 김준형; 이건우; 장민석, 제21회 첨단레이저 및 레이저 응용 워크샵 (ALTA - 2022), 한국광학회, 2022-05-03 |
| Temperature-dependent resistivity of graphene rippled on size-controlled Si-nanocrystal layers Yang, Seung Bum; Kim, Sung; Kim, Jungkil; Choi, Suk-Ho; Choi, HongKyw; Choi, Sung-Yool, 2011 MRS Fall Meeting & Exhibit, 2011 MRS Fall Meeting & Exhibit, 2011-11-28 |
| Temperature-Dependent Saturation Characteristics of Injection Seeded Fabry-Perot Laser Diodes/Reflective Optical Amplifiers Meng, Hongyun; Moon, Jung-Hyung; Choi, Ki-Man; Lee, Chang-Hee, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.28, no.3, pp.240 - 245, 2010-02 |
| Temperature-dependent through-silicon via (TSV) model and isolation characteristics = 온도에 의존하는 관통 실리콘 비아 모델과 아이솔레이션 특성link Lee, Man-Ho; 이만호; et al, 한국과학기술원, 2012 |
| Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
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