Browse "School of Electrical Engineering(전기및전자공학부)" byTitle

Showing results 321 to 340 of 46614

3 Dimensional transmission line matrix (3D TLM) modeling and analysis of through silicon via (TSV) coupling in 3 dimensional integrated circuit (3D IC) = 3차원 전송선 매트릭스 방법을 이용한 3차원 집적회로에서 사용되는 실리콘 관통 비아의 잡음전달 현상에 대한 모델링 및 분석link

Cho, Jong-Hyun; 조종현; et al, 한국과학기술원, 2010

3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB

Kim, Jounghoresearcher; Kim, Tae Hong; Lee, Junho; Kim, Hyungsoo, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.217 - 220, IEEE, 2002

3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB

Kim, Tae Hong; Kim, Hyungsoo; Pak, Jun So; Kim, Jounghoresearcher, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.181 - 284, IEEE, 2010-11-15

3 전극 가스센서 구동 방법

유형준researcher; 박정호; 박종욱researcher; 박광민; 김태완, 2017-02-22

3 차원 LADAR 영상에서의 Range correlation 기법

박동조researcher; 김병욱; 오민석, 한국군사과학기술학회 종합학술대회, 2009

3 차원 LIDAR 영상에서의 calibration 기법 연구

박동조researcher; 김병욱; 오민석, 영상처리 및 이해에 관한 워크�, 2009

3 차원 구조체 기판을 이용한 비정질 박막 실리콘 태양 전지 제작 및 응용 = Amorphous silicon thin-film solar cells on 3D structure and its applicationslink

이용민; Lee, Yong-Min; et al, 한국과학기술원, 2012

3 차원 세포의 전기생리 신호 측정 장치 및 그 제조 방법

이현주researcher; 심채연; 조예현; 김기업

3 차원 이미지 생성 방법 및 장치

배현민researcher; 황건필; 김서현

3- Transistor Cell OTP ROM Array Using Standard CMOS Gate-Oxide Antifuse

Kim, Jinbong; Lee, Kwyro, Journal of Semiconductor Technology and Science, 2003-12

3-Cell 하향링크 MIMO 간섭 채널에서의 간섭 공간 재활용 및 QoS Constraint에 따른 그 적용 방안

Yoon, Jangho; 이황수researcher, 한국통신학회논문지, v.37, no.12, pp.1093 - 1105, 2012-12

3-D adaptive simulation of thermal oxidation process

Cho, Byung Jinresearcher; Yoon, SH; Lee, JH; Won, TY; Kim, JC; Lee, DH, 26th European Solid State Device Research Conf. (ESSDERC), pp.0 - 0, 1996-09-09

3-D Command State-Based Modifiable Bipedal Walking on Uneven Terrain

Hong, Young-Dae; Kim, Jong-Hwanresearcher, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.18, no.2, pp.657 - 663, 2013-04

3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

Yoon, Jun-Boresearcher; Kim, BI; Choi, YS; Yoon, Eresearcher, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.279 - 288, 2003-01

3-D diffuser lithography and its application to LCD/LED backlight unit and flexible front-light unit

Yoon, Jun-Boresearcher, 14th International Display Workshops, IDW '07, v.4, pp.1345 - 1348, 2007-12-05

3-D image Crosstalk Reduction by Controlling the Width of the Electrode in a Liquid Lenticular Lens

Shin, Dooseub; Kim, Junoh; Kim, Cheoljoong; Lee, Junsik; Koo, Gyo Hyun; Sim, Jee Hoon; Won, Yong Hyubresearcher, IEEE PHOTONICS JOURNAL, v.10, no.4, 2018-08

3-D lithography and metal surface micromachining for RF and microwave MEMS

Yoon, Jun-Boresearcher; Kim, B.-I.; Choi, Y.-S.; Yoon, Euisikresearcher, 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002, pp.673 - 676, 2002-01-20

3-D medical image compression using an adaptive mode selection technique in wavelet transform domain

Cho, H.D.; Ra, Jong Beomresearcher, Picture Coding Symposium 1999, pp.91 - 94, Springer, 1999-04-21

3-D MEMS scanning system for dual-axis confocal microendoscopy

Jeong, Jae-Woongresearcher; Mandella, Michael J.; Kino, Gordon S.; Contag, Christopher H.; Solgaard, Olav, International Conference on Optical MEMS and Nanophotonics, IEEE, 2011-08-10

3-D Micro-structure Fabrication Technology and Its Application to Inkjet Printhead

윤준보researcher; 이재덕; 한철희researcher; 김충기, 제 5 회 한국 반도체 학술대회, pp.169 - 170, 1998-02



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