| 25581 | Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Ho; Shim, Yu-Jeong; Kim, Ga-Won, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.410 - 420, 2010-05 |
| 25582 | Modeling and experimental verification to investigate the effect of power supply noise imbalance on 900MHz differential LNA Koo, K.; Shim, J.; Shim, Y.; Kim, Joungho, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.343 - 346, IEEE, 2008-05-12 |
| 25583 | Modeling and improved current control of series resonant converter with nonperiodic integral cycle mode Ko, Jung Ho; Hong, Sung Soo; Kim, Marn Go; Youn, Myung Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.7, no.2, pp.280 - 288, 1992-04 |
| 25584 | Modeling and Improved Predictive Current Control for Buck-Boost Series Resonant Inverter Gun-Woo Moon; Jung-Hoon Lee; In-Cheol Baik; Kyeong-Hwa Kim; Myung-Joong Youn, JOURNAL OF ELECTICAL ENGINEERING AND INFORMATION SCIENCE, v.1, no.1, pp.51 - 57, 1996-02 |
| 25585 | Modeling and Inproved Current Control of Series Resonant Converter with Non-Periodic Integral Cycle Mode Ko, JH; Hong, SS; Kim, MG; Youn, Myung Joong, pp.745 - 751, 1991-06 |
| 25586 | Modeling and investigation of noise isolation in hierarchical power distribution network (PDN) for 3D system-in-package (SiP) = 3차원 시스템-인-패키지를 위한 계층적 전력 분배망의 잡음 분리에 관한 모델링 및 연구link Park, Hyun-Jeong; 박현정; et al, 한국과학기술원, 2009 |
| 25587 | Modeling and measurement analysis of through silicon via (TSV) and defects = 실리콘 관통 비아 및 결함의 모델링과 측정 분석link Jung, Daniel Hyun-Suk; 정현석; et al, 한국과학기술원, 2013 |
| 25588 | Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs) Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08 |
| 25589 | Modeling and Measurement of High-bandwidth and High-density Silicone Rubber Socket for 100Gbps Transceiver IC Test Park, Jun Yong; Kim, Hye Soo; Won, Hyo Sup; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Michael; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25 |
| 25590 | Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model Kim, Jae-Min; Jeong, You-Chul; Lee, Jun-Ho; Ryu, Chung-Hyun; Shim, Jong-Joo; Shin, Min-Chul; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, pp.544 - 557, 2008-08 |
| 25591 | Modeling and measurement of mode-conversion and frequency dependent loss in high-speed differential interconnections on multilayer PCB Baek, S; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E88C, pp.1992 - 2000, 2005-10 |
| 25592 | Modeling and measurement of mode-conversion and frequency dependent loss in high-speed serial interconnection = 고속 직렬 신호선의 모드 전환 및 주파수 의존 손실을 고려한 모델링 및 측정link Baek, Seung-Yong; 백승용; et al, 한국과학기술원, 2006 |
| 25593 | Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis Bae, Bumhee; Shim, Yujeong; Koo, Kyoungchoul; Cho, Jonghyun; Pak, Jun So; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.6, pp.1260 - 1270, 2013-12 |
| 25594 | Modeling and measurement of radiated emission through a cutout on the power/ground plane Lee, J.; Kang, J.; Park, K.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.776 - 780, IEEE, 2006-08-14 |
| 25595 | Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02 |
| 25596 | Modeling and measurement of simultaneous switching noise coupling and radiation through a cutout and vias in multi-layer packages and PCBs = 다층 패키지 및 인쇄회로기판에서 절단면 및 비아를 통한 잡음신호의 커플링과 방사에 대한 모델링 및 측정에 대한 연구link Lee, Jun-Woo; 이준우; et al, 한국과학기술원, 2005 |
| 25597 | Modeling and measurement of simultaneous switching noise coupling through signal via transition Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08 |
| 25598 | Modeling and measurement of through glass via-channels, noise coupling and suppressions in glass interposer for digital system package = 디지털 시스템 패키지를 위한 글래스 인터포저 상의 글래스 관통비아 채널, 노이즈 커플링 및 억제 모델링과 측정을 통한 검증link Park, Gapyeol; Kim, Joungho; et al, 한국과학기술원, 2018 |
| 25599 | Modeling and parameter estimation for quality-optimal code rate decision in joint source-channel coding = 소스-채널 부호화의 화질에 최적화된 부호율 결정을 위한 모델링과 파라미터 예측기법link Jeong,Yo-Won; 정요원; et al, 한국과학기술원, 2012 |
| 25600 | Modeling and performance analysis of diffusion-based molecular communication system for nanonetworks = 나노네트워크를 위한 확산기반 분자통신 시스템의 모델링 및 성능 분석link Lee, Jeongman; 이정만; et al, 한국과학기술원, 2016 |
