Browse "School of Electrical Engineering(전기및전자공학부)" by Subject power distribution network (PDN)
Showing results 1 to 11 of 11
| 40-Gb/s package design using wire-bonded plastic ball grid array Kam, Dona Gun; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, no.2, pp.258 - 266, 2008-05 |
| Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards Kim, Joungho; Rotaru, MD; Baek, S; Park, J; Yer, MK, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.319 - 330, 2006-05 |
| Design of high-performance and low-cost channel in high-speed serial link = 고속 직렬 링크 내 저가형 고성능 채널 설계link Kam, Dong-Gun; 감동근; et al, 한국과학기술원, 2006 |
| Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02 |
| Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; Park, Hyunwook; Park, Junyong; Lee, Seongsoo; Shim, Daeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09 |
| Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 |
| Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12 |
| Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08 |
| Segmentation method based modeling and analysis of a glass package power distribution network (PDN) Kim, Youngwoo; Fujimoto, Daisuke; Kaji, Shugo; Wada, Shinpei; Park, Hyunwook; Lho, Daehwan; Kim, Joungho; et al, IEICE NONLINEAR THEORY AND ITS APPLICATIONS, v.11, no.2, pp.170 - 188, 2020-04 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM) Park, Hyunwook; Kim, Minsu; Kim, Seongguk; Kim, Keunwoo; Kim, Haeyeon; Shin, Taein; Son, Keeyoung; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.70, no.11, pp.4772 - 4786, 2022-11 |
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