Browse "School of Electrical Engineering(전기및전자공학부)" bySubjectpackaging

Showing results 1 to 5 of 5

A Low Contact Resistance 4-Terminal Mems Relay: Theoretical Analysis, Design, and Demonstration

Yoon, Yong Hoon; Jin, Yun Su; Kim, Chang-Keun; Hong, Songcheolresearcher; Yoon, Jun-Boresearcher, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.27, no.3, pp.497 - 505, 2018-06

Compact packaging of optical and electronic components for on-board optical interconnects

Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02

Electrical Characterization of Screen-Printed Circuits on the Fabric

Kim, Yongsang; Kim, Hyejung; Yoo, Hoi-Junresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, pp.196 - 205, 2010-02

Fabrication of optical splitter and passive alignment technique with a femtosecond laser

Sohn, IB; Lee, Man Seopresearcher; Chung, JY, IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, pp.2349 - 2351, 2005-11

광섬유 자이로용 집적광학 칩의 제작과 신뢰성 시험 = Fabrication and reliability test of integrated optical chips for the fiber optic gyrolink

방규철; Bang, Kyu-Chul; et al, 한국과학기술원, 2003



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