Browse "School of Electrical Engineering(전기및전자공학부)" bySubjectpackage

Showing results 1 to 7 of 7

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Kim, Myung-Hoi; Koo, Kyoung-Choul; Hwang, Chul-Soon; Shim, Yu-Jeong; Kim, Joung-Horesearcher; Kim, Jong-Hoon, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.54, no.3, pp.689 - 695, 2012-06

Advanced multiple line grid array (MLGA) structures for improved characteristics at GHz frequency range = 기가헤르츠 주파수영역에서 전달특성향상을 위한 Multiple line grid array (MLGA) 구조에 관한 연구link

Baek, Seung-Yong; 백승용; et al, 한국과학기술원, 2001

High frequency modeling of multiple line grid array (MLGA) package and embedded passives = Multiple line grid array (MLGA) 패키지의 고주파 모델과 내부 삽입 수동 소자 연구link

Lee, Jun-Ho; 이준호; et al, 한국과학기술원, 2001

High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoungresearcher; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07

Low Cost wafer-level packaging method based on anodized aluminum substrate with backside signal Pad and EMC passivation = 양극산화 알루미늄 기판 기반의 신호 패드 및 에폭시 몰딩 컴파운드의 보호막을 포함한 웨이퍼 레벨 패키지link

Kim, Young-Joon; 김영준; et al, 한국과학기술원, 2010

Microwave frequency crosstalk model of redistribution line patterns on wafer level package

Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05

PCB and package level wireless power transfer interconnection scheme using magnetic field resonance coupling = 자기장 공진 커플링을 이용한 피씨비 및 패키지의 무선 전력 전송 구조link

Kim, Sukjin; 김석진; et al, 한국과학기술원, 2016



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