Showing results 1 to 8 of 8
A 4.2-mW 10-MHz BW 74.4-dB SNDR Continuous-Time Delta-Sigma Modulator With SAR-Assisted Digital-Domain Noise Coupling Jang, Il Hoon; Seo, Min-Jae; Cho, Sang-Hyun; Lee, Jae-Keun; Baek, Seung-Yeob; Kwon, Sunwoo; Choi, Michael; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.53, no.4, pp.1139 - 1148, 2018-04 |
A three-dimensional stacked-chip star-wiring interconnection for a digital noise-free and low-jitter I/O clock distribution network Ryu, C; Chung, D; Lee, C; Kim, Joungho; Bae, K; Yu, J; Lee, S, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.651 - 653, 2006-12 |
Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards Kim, Joungho; Lee H., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.4, pp.724 - 735, 2005-11 |
Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS Kim, KD; Park, J; Lee, JG; Kim, Joungho; Lee, JH, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.45, pp.557 - 559, 2005-06 |
Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor Kim, Joungho; Jeong, Y, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.534 - 536, 2006-10 |
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
Modeling and measurement of simultaneous switching noise coupling through signal via transition Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08 |
Noise coupling analysis and reduction in 3D-IC considering through-silicon via (TSV) nonlinearity = 3차원 집적회로에서 TSV의 비선형성을 고려한 노이즈 커플링 분석 및 감소에 관한 연구link Cho, Jong-Hyun; 조종현; et al, 한국과학기술원, 2013 |
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