Browse "School of Electrical Engineering(전기및전자공학부)" by Subject VACUUM PACKAGE
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| Use of nanoporous columnar thin film in the wafer-level packaging of MEMS devices Lee, Byung-Kee; Choi, Dong-Hoon; Yoon, Jun-Bo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.4, 2010-04 |
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