Browse "School of Electrical Engineering(전기및전자공학부)" bySubjectJOINTS

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1
Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump

Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoonresearcher; Jeon, DukYoungresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02

2
Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices

Song, Jinseop; Kim, Yeongseon; Cho, Byung Jinresearcher; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03

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