Browse "School of Electrical Engineering(전기및전자공학부)" by Author Byun, J.-G.
Showing results 1 to 5 of 5
| Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Joungho, 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235, IEEE, 2003-08-18 |
| Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line Kim, J.; Jun, P.; Byun, J.-G.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.189 - 192, IEEE, 2002-05-12 |
| Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13 |
| Experimental investigation of radiated emission from flexible printed circuit (FPC) cable Ahn, S.; Kim, J.; Lee, H.; Kim, Joungho; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.883 - 888, IEEE, 2002-08-19 |
| Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board Baek, S.; Kam, D.G.; Par,k B.; Kim, Joungho; Byun, J.-G.; Choi, C.-S., 2002 IEEE International Symposium on Electromagnetic Compatibility, pp.200 - 204, IEEE, 2002-08-19 |
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